Electronics gel for encapsulating electrical components with protective functions against vibrations, mechanical and thermal stresses, as well as water and environmental influences. Typical properties: transparent, low viscosity, self-adhesive, with good dielectric properties, soft and resilient. The gel cures at room temperature or through heat and adheres after complete curing to aluminum, stainless steel, AVS, polycarbonate, FR4 circuit board material, and nylon 6,6. * Pot life is approximately 45 minutes * Curing at RT or heat-curing * Temperature resistance from -55 to +200 °C * Very good adhesion to the mentioned materials * Gel remains self-adhesive and soft, yet resilient
Potting of electrical components - protection against vibration, mechanical and thermal stresses, as well as against water and other environmental influences. Typical product characteristics of the electronics gel: transparent, very low viscosity, self-adhesive, good dielectric properties, soft yet resilient, pot life 45 min, room temperature or heat curing, -55 to +200°C. The fully cured gel adheres well to: • Aluminum • Stainless steel • AVS • Polycarbonate • FR4 circuit board material • Nylon 6,6.
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